Which Windows command allows you to see the operating system version and system name, manufacturer, and model?
A. msconfig
B. uname
C. msinfo32
D. winver
Which benefit is provided by having identical Interconnect modules in adjacent bays of the c7000 enclosure?
A. reduced power requirements
B. dynamic IO bandwidth
C. improved uplink failure detection
D. redundant IO capabilities
Which Virtual Connect module enables FCoE or iSCSI connectivity for the c-class server blades?
A. VC1/10Gb-F
B. VC-FC 8/24
C. VC Flex-10
D. VC FlexFabric
When the enclosure management address is not configured, which tool is used to check the Onboard Administrator (OA) Service IP?
A. HP Systems Insight Manager
B. OA Management Homepage
C. Onboard Administrator CLI
D. Insight Display
What must be verified when replacing the Virtual Connect FlexFabric modules in a c7000 enclosure?
A. Baseboard Management Controller firmware on all server blades
B. Virtual Connect Manager SSO authentication with Onboard Administrator of the enclosure
C. Onboard Administrator firmware and LOM firmware on server blades
D. ILO firmware of the blade server located in bay 1 only
Which Windows command allows you to get the operating system's version, build, service patch level, as well as all the hotfixes?
A. winver
B. msinfo32
C. msconfig
D. systeminfo
Which Advanced Memory Protection (AMP) features are available on a ProLiant BL460c G6? (Select three.)
A. Memory Non-Lock-Step mode
B. online replace and addition memory
C. advanced error checking and correcting
D. hot plug RAID memory
E. online spare memory
F. mirrored memory
An HP ProCurve 6120G/XG Ethernet Blade Switch has a blinking amber LED for 10/100/1000 port 1. What does this indicate?
A. network link fault
B. link activity at 1 Gb/s
C. prefailure warning
D. switch failure
How many BL2x220c G6 server nodes can you fit in a c7000 enclosure?
A. 8
B. 16
C. 24
D. 32
Which benefits does the new DDR-3 memory technology offer? (Select three.)
A. ability to intermix registered and unregistered DIMMs
B. bandwidth increased to 1333MHz
C. address parity detection
D. bandwidth increased to 667 MHz
E. smaller footprint for increased density
F. larger footprint for increased storage